Abstract
Heat dissipation of 3D-ICs systems is highly nonuniform and nonunidirectional due to many factors such as power architecture and transistor packing density available on the chip. In this study, the cooling response time analysis of an active cooling method to cool a 25 W stack-dice to approximately 13°C within 400 s utilizing multidimensional configured thermoelectric coolers will be presented. The results obtained from this study are beneficial not only to 3D-ICs with or without core hopping architecture cooling, but also to thermal cycling of ICs in general, utilizing thermoelectric modules to obtain rapid and precision ramping control and lower setup costs compared to a conventional thermal chamber.
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