Response Spectrum Analysis of Printed Circuit Boards Subjected to Shock Loads

Abstract

A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to shock loads is important for mechanical design and reliability of electronic packages. The modeling and analysis of printed circuit boards is required for accurate prediction of response due to shock loads. The validated finite element model of the PCB can be adopted to perform response spectrum analysis. Shock response spectrum analysis of printed circuit boards subjected to a half-sine pulse excitation is carried out using finite element method. The objective of this paper is to predict the shock response spectrum of a printed circuit board due to launch environment. The analysis results are validated by conducting experimental tests of PCB.