Abstract
Micro-scale laser shock peening (μLSP) can potentially be applied to metallic structures in microdevices to improve fatigue and reliability performance. Copper thin films on a single-crystal silicon substrate are treated by using μLSP and characterized using techniques of X-ray microdiffraction and electron backscatter diffraction (EBSD). Strain field, dislocation density, and microstructure changes including crystallographic texture, grain size and subgrain structure are determined and analyzed. Further, shock peened single crystal silicon was experimentally characterized to better understand its effects on thin films response to μLSP. The experimental result is favorably compared with finite element method simulation based on single-crystal plasticity.
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