Abstract
Failure analysis is being performed in order to improve performance and stability of semiconductor devices. It is often required to detect and locate the failure without mold decapsulation. Conventional PEM(Photo Emission Microscope) and IR-OBIRCH (InfraRed Optical Beam Induced Resistance CHange)do not detect signal in package state because both the emission light and the stimulation light for IR-OBIRCH do not propagate through the package mold. Therefore we have proposed a new technique for package failure analysis using ultrasonic stimulation. This report describes the basic detection performances by using wiring sample that has simple structure, and the detection example of microcontroller sample with a failure between Vdd and Vss.
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