Resist evaluation for fabrication of diffractive optical elements (DOEs) with sub-micron resolution in a MEMS production line

Abstract

Diffractive optical elements (DOEs) represent small, lightweight and potentially low-cost alternatives to conventional optical components. We have evaluated photoresists and processes for fabrication of silicon micro-machined DOEs with a sub-micron pattern using an MA150 (Suss) proximity aligner. The resists HiPR 6512 (Fuji film), AZ ECI 3007 (AZ Electronics Materials), IX335 H (JSR Micro) and UVIII (Rohm and Haas) were all able to resolve the desired 0.8 µm pattern, but the wall angle obtained with IX335H was a superior 86°. Double development of the resists proved possible in a KOH-based developer but unfeasible in a TMAH-based developer. The final DOE device was successfully realized based on the optimized photolithography process.