Abstract
AbstractThis article reports the preparation of a number of high molecular weight aromatic amide and imide polymers. An order of relative thermal stability of a series of alternative linkages between benzene rings in aromatic polymers is established on the basis of weight loss of thin films in air. It is found to agree with the stability order established by others by study of model compounds. It is further confirmed by the aging performance of laminates employing such resins. Electrical properties of the polymers were measured as a function of temperature. Change in the dissipation factor with temperature was used to determine Tg, which in turn was correlated to the minimum temperature required to produce laminates. Examples of the performance of these organic polymers in long time exposure tests at elevated temperature are given. Flexural properties of laminates aged and tested at temperatures of 600–650°F are reported.
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