Abstract
The article describes the results of 2 yr's work evaluating suitable conductive and insulating resins for the attachment of semiconductor dice. The resin attachment is considered and its advantages over the normal eutectic methods discussed. Detailed results of tests are shown for the materials finally selected.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
