Abstract
The evolution of residual stresses as a function of bilayer period from 10nmto1μm in sputter-deposited Cu/330 stainless-steel (SS) multilayered films is evaluated by the substrate curvature technique. The multilayer stress evolution is compared with residual stresses in single layer Cu films and single layer 330 SS films, also measured by substrate curvature technique, with respective film thicknesses varying from 5to500nm. Both single layer and multilayer films exhibit high tensile residual stresses that increase with decreasing layer thickness, but are found to be lower than the respective yield strengths. The intrinsic tensile residual stress evolution with film thickness is explained using the island coalescence model. The difference between the multilayer residual stress and the average residual stresses in single-layered Cu and 330 SS films is interpreted in terms of interface stress.
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