Abstract
This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
