Abstract
This paper utilizes pulse reverse plating to control the residual stress in electroplated copper MEMS structures. The residual stress plays a significant role in many micro electro mechanical system (MEMS) devices and control (not just minimization) over it is desirable. We have tuned the stress either compressive or tensile for different plating parameters, without utilizing any additives in the bath or annealing in the process. We demonstrate the use of this technique using a UV-LIGA fabricated microstrain gauge, that is also utilized to measure the stress. We show that the stress can be tuned from a value of 364 MPa to –194 MPa by varying the pulse plating parameters like ratio of forward/reverse time and temperature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
