Abstract
Thermal residual macrostresses and their gradients were studied in a series of polycrystalline diamond compacts (PDC) using neutron diffraction. The specimens comprised WC–Co cemented carbides with high temperature/high pressure (HTHP) sintered polycrystalline diamond (PCD) layers. Residual stresses were investigated in two as-sintered variants and after several post-sinter thermal treatments and bonding processes. Measurements were made of (1) the average in-plane stress in the diamond layer for each sample and (2) the average in-plane stress gradient in both the WC–Co substrate and the diamond layer in a subset of the samples. Average in-plane stresses in the diamond layer ranged from −250 to −582 MPa. Sintering process parameters, thermal treatments, and bonding were all found to affect residual stress levels and stress gradient characteristics. Measured average in-plane stress gradients are shown to differ substantially in some cases from linear elastic predictions.
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