Abstract
We have studied the presence of residual chlorine in thin TiO2 films grown by plasma enhanced atomic layer deposition (PEALD) at temperatures within 40–250°C range, using x-ray photoemission spectroscopy, secondary ion mass spectrometry, grazing incidence x-ray diffraction and scanning electron microscopy. The source of the residual chlorine is TiCl4, which was used as a titanium precursor in ALD. The PEALD results are compared with the results on ALD films grown thermally in the same reactor. Films deposited by PEALD show a lower amount of residual chlorine, while chlorine concentration decreases with the processing temperature in both ALD techniques. In addition to the standard signal from residual chlorine bonded to Ti, a strong signal from ClO bonds was observed in PEALD samples grown at low temperatures. Our study also shows the development of an anatase phase in TiO2 films grown above 200°C, which correlates well with the reduction of both types of residual chlorine in PEALD samples.
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