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Abstract
With the rapid development of integrated circuits, its lead frame is increasingly high precision, which puts forward higher requirements for the current research status and key technologies. In this paper, the higher requirements and innovations for the structure control of complex alloying, deformation, and heat treatment of high-precision lead frames manufactured by etching are reviewed. The relevant industrial chain at home and abroad and its current situation are introduced. The key manufacturing technology of high-precision etched lead frame is analyzed. At last, the key technology prospect and the development trend of integrated circuit lead frames in our country are discussed.
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