Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys

Abstract

High-pressure die casting (HPDC) has been extensively used to manufacture aluminum alloy heat dissipation components in the fields of vehicles, electronics, and communication. With the increasing demand for HPDC heat dissipation components, the thermal conductivity of die-cast aluminum alloys is paid more attention. In this paper, a comprehensive review of the research progress on the thermal conductivity of HPDC aluminum alloys is provided. First of all, we introduce the general heat transport mechanism in aluminum alloys, including electrical transport and phonon transport. Secondly, we summarize several common die-cast aluminum alloy systems utilized for heat dissipation components, such as an Al–Si alloy system and silicon-free aluminum alloy systems, along with the corresponding composition optimizations for these alloy systems. Thirdly, the effect of processing parameters, which are significant for the HPDC process, on the thermal conductivity of HPDC aluminum alloys is discussed. Moreover, some heat treatment strategies for enhancing the thermal conductivity of die-cast aluminum alloys are briefly discussed. Apart from experimental findings, a range of theoretical models used to calculate the thermal conductivity of die-cast aluminum alloys are also summarized. This review aims to guide the development of new high-thermal-conductivity die-cast aluminum alloys.