Research progress on heat dissipation technology of vapor chamber

Abstract

Vapor chamber is a new type of two-phase flow heat dissipation technology. It offers the benefits of excellent thermal conductivity, uniform and consistent temperature, and the ability to reverse heat flow direction. It addresses the limitations of conventional heat pipes, such as limited contact area, high thermal resistance, and non-uniform heat flow. In the future, it will be an effective solution for cooling high heat flux electron devices in the electronic industry. This paper summarizes three types of wicks: micro-channel, sintered powder, and sintered screen. This article contrasts the benefits and drawbacks. This brief overview illustrates the latest advancements in heat and mass transfer theory related to vapor chamber, both domestically and internationally. Scholars employ the boiling theory of transport modelling to capture the gas-liquid interface, ascertain the critical heat flux, and analyze the flow and heat transfer laws of the working fluid in the uniform temperature plate. This paper analyzes several factors that affect the performance of the uniform temperature plate, including the selection of fluid, filling rate of liquid, size and distribution position of heat source input power, and working angle. Finally, this study analyzes and forecasts the practical applications of vapor chamber, taking into account the surrounding environmental factors.