Abstract

<sec>Developing thermally conductive polymers is of fundamental interest and technological importance. Common polymers have low thermal conductivities on the order of 0.1 W·m<sup>–1</sup>·K<sup>–1</sup> and thus are regarded as thermal insulators. Compared with the traditional heat conductors (metals and ceramics), polymers have unparalleled combined properties such as light weight, corrosion resistance, electrical insulation and low cost. Turning polymer insulators into heat conductors will provide new opportunities for future thermal management applications. Polymers may replace many metals and ceramics, serving as lightweight heat dissipators in electronics, refrigerators, and electrical vehicles.</sec><sec>In this review and perspectives, we discuss the research progress of thermal transport mechanisms in polymers and reveal the relations between thermal conductivity and polymer structural parameters such as bond strength, crystallinity, crystallite size, chain orientation, radius of gyration, and molecular weight. We discuss the advanced strategies for developing thermally conductive polymers by both bottom-up and top-down approaches. We highlight how thermally conductive polymers provide new opportunities for thermal management applications. Finally, we emphasize the future challenges to and opportunities for designing and synthesizing polymers with metal-like thermal conductivity and exploring the thermal transport physics in polymers. We believe that the thermally conductive polymers with their unparalleled combination of characteristics (light weight, electrical insulation, easy processability, corrosion resistance, etc.) promise to possess many existing and unforeseen thermal management applications.</sec>

Highlights

  • Polymer structures at micro-nano scale and atomic scale. Defects such as chain ends, amorphous chains, chain entanglement, impurities in polymers act as heat carrier scattering sites and hinder efficient thermal transport, result in relatively low thermal conductivity[24]

  • 正如原子模拟结果所示, 结晶聚乙烯单链沿骨 架方向有希望能达到很高的理论热导率 [35], 这一 结果在 Fermi 等 [37] 对一维热导体的非遍历特性讨 论中也得到了支持

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Summary

Introduction

交联对硅橡胶热导率影响的分子动力学模拟 Molecular dynamics simulation of effect of crosslinking on thermal conductivity of silicone rubber 物理学报. GaN薄膜的热导率模型研究 Thermal conductivity modeling of GaN films 物理学报. 含有倾斜界面硅/锗超晶格的导热性能 Thermal conductivity of Si/Ge superlattices containing tilted interface 物理学报. 热智能材料及其在空间热控中的应用 Thermal smart materials and their applications in space thermal control system 物理学报. III-V族硼基化合物半导体反常热导率机理 Origin of abnormal thermal conductivity in group III-V boron compound semiconductors 物理学报. 不同周期结构硅锗超晶格导热性能研究 Thermal conductivities of different period Si/Ge superlattices 物理学报.

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