Research on thermal resistance Measurement method of high power LED

Abstract

Due to the special packaging and working conditions of high-power LEDs, it is a huge challenge to accurately measure the junction-to-case thermal resistance. The traditional transient dual interface and structure function methods have been successfully applied to measure the thermal resistance of high-power LEDs. In this paper, a different interface condition is designed to change the contact thermal resistance between the DUT and the heat sink, making the Z th curve separation point clearer. More importantly, the structural thermal resistance between multiple layers on the heat flow path of the device is obtained by converting the Z th curve. Finally, the effectiveness of the method is verified by comparative analysis of experimental data.