Abstract
Bonding strength is an important indicator to measure the life of the package in the process of Electronic Packaging. Anisotropic conductive adhesive film is a kind of package bonding. In this paper, scanning electron microscopy is used to compare the microstructure and element distribution of two different types of conductive adhesives CP6920F and HA5125PL both before and after flip-chip curing. At the same time, the 280SJ four-point probe sheet resistance tester and Bruker Icon atomic force microscope are used to measure the electrical properties of the cured conductive adhesive, and we use INSTRON5985 electronic universal material testing machine to test the shear strength and tensile strength of the cured conductive adhesive film.
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