Research on the influence of stress wave on crack and chip formation mechanism in radial ultrasonic vibration assisted grinding

Abstract

The propagation of stress waves in the ultrasonic vibration grinding zone was studied and analyzed in this paper and the microscopic mechanism of ultrasonic vibration assisted grinding is clarified by combining the method of finite element analysis (FEA). The creation of an experimental platform for ultrasonic vibration assisted grinding allowed for a comparative experimental evaluation of radial ultrasonic vibration assisted grinding (RUVAG) and conventional grinding (CG). Experiments analysis show that: (a) Compared with conventional grinding, the alternating impact of stress waves in ultrasonic vibration grinding is beneficial to the propagation of microcracks and the removal of materials. Meanwhile, there is no burn on the machined surface, so the quality of the machined surface is better. (b) Under the alternating and superimposed action of stress waves, dislocation emission becomes difficult due to the suppressed thermal activation process. Therefore, the plastic deformation of the material is suppressed and reduced in the grinding zone, and the material is more likely to break than during conventional grinding. Therefore, compared with conventional grinding, both cracks and chips are easier to form in it..