Research on the influence of single-crystal germanium cutting parameters based on molecular dynamics

Abstract

As a metalloid with unique properties, single crystal germanium is widely used in semiconductors, infrared optics, and other fields. To ensure the processing accuracy of single-crystal germanium, it is necessary to optimise the selection of parameters during processing. This paper uses molecular dynamics methods to study the cutting process of single-crystal germanium with the cutting depth and cutting speed as parameters and uses nanoindentation method to test the mechanical properties of the processed single-crystal germanium surface. The study found that with the increase of cutting depth, the cutting force and cutting heat increased significantly, the depth of the deformed layer increased significantly, and the stiffness of single-crystal germanium decreased significantly; with the increase of cutting speed, there was no built-up edge Influence, the cutting force is reduced, and more cutting heat is generated, and the depth of the deformation layer is higher, and the HCP structure increases, but the cutting speed has no obvious relationship with the mechanical properties of the machined surface.