Research on the Influence of Device Thermal Equivalent Model on the Temperature Field of Infrared Hot Air Reflow Soldering

Abstract

Infrared hot air reflow soldering is an important process in SMT assembly process. The temperature field of infrared hot air reflow soldering of PCBA will directly affect the reliability of solder joints. The different simplified equivalent models have a certain influence on the temperature field of infrared hot air reflow soldering PCBA, which is mainly reflected in accuracy and efficiency. This paper studies the influence of three different thermal models on the temperature field of reflow soldering PCBA, and selects four groups of points in the same position of the three models, and comprehensively compares their temperatures. The results show that the maximum temperature deviation of the three models is as high as 7℃ in the soldering zone and 4℃ in the cooling zone, and the temperature difference is small. It can be concluded that the complex solder ball model can be used for high precision applications, and the simplified single-layer solder model and the thermal equivalent model can be used for low precision applications. These conclusions provide some references for the modeling of infrared hot air reflow soldering.