Abstract
During the reliability experiment, the stress will be transferred to the ceramic package through the elastic deformation of the cover plate, because of the large size of the cover plate of the ceramic package for system in package, resulting in an obvious stress concentration phenomenon on the side wall of the package. The reliability test of the ceramic package after sealed was simulated and analyzed by using the finite element method. the material and the structure of cover plate for influence on the package structure reliability was studied , analyzed the influence of different plate structure on the form and distribution of stress of the ceramic package, evaluated the cover plate structure on the influence of the package structure reliability. It provides a reliable theoretical basis for the design of the cover plate of this kind of package. The problems such as porcelain crack of package or device failure caused by cover plate deformation due to unreasonable cover plate design are avoided. Reasonable cover plate structure plays an important role in solving the failure problem in reliability test and improving the reliability of devices.
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