Abstract
Grounded vias modeling is used to analyze the impact on the high speed PCB EMC and SI issues in three aspects, including theoretical analysis, simulator modeling and practical PCB test. In this paper, we discuss the full-wave complex scattering parameter model and full-wave model. Then the full-wave analysis model of the through holes for model validation and comparison are established, by using numerical simulation software HFSS and CST Microwave Studio. The initial test results on the practical PCB show that the analyzed method is reasonable and accurate. And optimized design parameters can ensure the continuity of the impedance of vias, and introduce lesser return loss and insertion loss. It is shown that the signal transmission performance is greatly improved with the grounded via added, which is helpful in specifying the manufacturing tolerance of via designs.
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