Research on the design of mechanical shock test fixture of ceramic package for packaging CCD

Abstract

At present, the ceramic package packaging array charge-coupled device dimensions up to 144 mm*126mm*3mm (typical value), conventional mechanical shock fixture and tooling is not applicable needing to develop a dedicated fixture. In this paper, we mainly study the design of the mechanical shock fixture of the ceramic package for the large array CCD. The ansys finite element method was used to simulate and analyze the mechanical shock test of the ceramic package and the influence of the structure, shape and size of the fixture on the test was studied. Through theoretical analysis and test research provides a reliable theoretical basis for design the fixture, successfully designed and manufactured the general mechanical shock test fixture. Avoided the appearance of the ceramic package crack problems due to the fixture is not appropriate, making several kind of large array CCD of ceramic package smoothly through the examination of mechanical shock test.