Research on Temperature Stress for Contacts Reliability of Electric Connector

Abstract

Temperature induced degradation is a widely recognized failure phenomenon.However, the basic mechanisms that control the onset and progression of such behavior are not well understood and are a topic of considerable interest in the electrical connector community. In this paper, the simulation analysis of temperature field on this topic are described. The distribution graph of temperature field for the electrical connectors and the highest temperature of the surface of electrical connector was achieved by analyzing a single blade/receptacle contact pair FEA model. A mathematical model was developed that related the early stage temperature levels for the connectors.Additionally, the thermal deformation caused by the temperature had little effect on the contact stress based on temperature - structure coupling field analysis for the electrical connector, the impact of temperature on the electrical connector was mainly reflected in the rate of oxidation of the metal surface. The failure physical process of the electric connector was drawn under temperature stress through the model and theory analysis for the electrical connector , and reliability growth program of the electrical connector was achieved under the temperature influence. The same transfer functions for one type of contact pair were obtained from the simulation, and the results showed that for this limited system, finite element modeling and analysis have great potential for evaluating the influence of design variations on degradation behavior.