Abstract
To realize the connection of copper and Polyphenylene sulfide (PPS) by metal–polymer direct molding, this paper combined anodic oxidation and chemical corrosion to treat the surface of copper, and carried out the injection molding experiment. An orthogonal experimental arrangement was used to identify the optimal electrolyte and etching solution for preparing a microstructure on a copper surface. The bonding and fracture mechanisms of the copper–polymer assembly were investigated through injection molding experiment and SEM technology. The results revealed that the phosphoric acid concentration had the most significant effect on the microstructure quality and etching solution containing 20% phosphoric acid produced a uniform microstructure with 25.77% porosity and 5.52 MPa bonding strength. Meanwhile, SEM images of the interface from bonding to fracture in the copper–polymer assembly indicated a well-filled polymer in the microstructure with a mainly cohesive fracture mode.
Highlights
This study experimentally investigated copper surface treatments, the preparation process of a microstructure, and the bonding strength of a copper-Polyphenylene sulfide (PPS) assembly
The following conclusions were drawn from the study: (1) The microstructure of a copper surface was prepared using a surface treatment process that combined chemical and electrochemical methods
(2) The influence of various process parameters on the quality of the copper surface microstructure was studied through orthogonal experiments, and the phosphoric acid concentration was found to have the greatest influence, followed by the sodium dihydrogen phosphate concentration, electrolysis voltage, electrolysis time, chemical corrosion time, and sodium carbonate concentration
Summary
Due to the demand for lightweight products, the performance of a single material can no longer meet the needs of the market, and the composite molding of multiple materials has become a trend. As for the investigation of copper surface treatment, Kim et al [17] adopted thermal precipitation technology to treat the copper, and found that hydrogen plasma treatment significantly enhances the bonding strength between the copper and polymer by improving significantly enhancesofthe bonding strength between theiscopper and polymer by improving the hydrophobicity metal. This method complex and expensive, and diffithe hydrophobicity of metal. To overcome these problems, oxidation andin chemical corrosion to prepare microstructure on theanodic surface of copper this work. The bonding strength of each assembly was tested, and the microstructure was bonding analyzedstrength by SEM.of each assembly was tested, and the microstructure was analyzed by SEM
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