Abstract

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

Highlights

  • With the development of semiconductor technology, a lot of power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely applied to high-power inverters, high voltage direct current high voltage direct current (HVDC) transmissions, and so on [1,2,3]

  • The printed circuit board (PCB) Rogowski coil made in this paper is depicted by the physical map and coil size shown

  • When the measured current peak value was 300 A, the output waveform of the PCB Rogowski coil sensor and PEM CWT Rogowski coil were basically the same; since the sensitivity of the sensor was 10 mV/A, the internal circuit configuration of the operational amplifier determined that the amplitude of the output signal did not exceed the supply voltage

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Summary

Introduction

With the development of semiconductor technology, a lot of power electronics devices such as IGBTs have been widely applied to high-power inverters, high voltage direct current high voltage direct current (HVDC) transmissions, and so on [1,2,3]. Commercially available current transformers and Rogowski coil current sensors are difficult to mount inside devices due to their large sizes. D. et al proposed a new Rogowski coil with multiple PCB boards stacked to monitor the gate current outside the press-pack IGBT package. Gerber D. et al proposed a new Rogowski coil with multiple PCB boards stacked to monitor the sharing characteristics of the welded IGBT module [10,11,12]. A miniature, thin and low-cost Rogowski coil sensor is proposed for its boss coil based on 6-layer PCB layout in the literature and applied it to the study of the current sharing geometry, without changing the internal structure of the device. A miniature, thin and low-cost Rogowski coil sensor is proposed for its boss geometry, different driving modes is monitored. Simulation and experimental verification of the proposed sensor is carried out

PCB Rogowski Coil Sensor
The Working
Error Analysis of Rogowski Coil
Fishbone
Parameters
Subsequent Integration Circuit Design
Lumped
Simulation of PCB Rogowski Coil
10. In Figurewith
Experimental Verification of the PCB Rogowski Coil Current Transformer
Conclusions
Measurement of multiple chip in of a Press-Pack using
Full Text
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