Abstract
A series of PI-EP composite materials under different imidization temperature gradients were prepared from 3,3'-diethyl-4,4'-diamino diphenyl methane (DEDA DPM), benzop-henone tetracarboxylic acid dianhydride (BTDA) and epoxy resin (E-51), and thermal imide process was used. Fourier transform infrared spectroscopy (FI-TR) indicated that the chemical reactions between poly(amic acid) and epoxy resin was existence and imide ring had formed. Heat-resistant property, dielectric property and mechanical property of PI-EP composite materials were tested, respectively. The results showed that the order of the materials heat resistance was 493 K>;523 K>;473 K>; 453 K, dielectric constant and dielectric loss were ranged from 3.30~3.68 and 1.2×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> ~1.3×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> , the shear strength of PI-EP-493 K was the best and attained maximum value 8.962 MPa, the adhesive forces of all composite materials were at the higher level (one or two level), fully met the applied requirement.
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