Abstract

Vision-based object detection of PCB (printed circuit board) assembly scenes is essential in accelerating the intelligent production of electronic products. In particular, it is necessary to improve the detection accuracy as much as possible to ensure the quality of assembly products. However, the lack of object detection datasets in PCB assembly scenes is the key to restricting intellectual PCB assembly research development. As an excellent representative of the one-stage object detection model, YOLOv3 (you only look once version 3) mainly relies on placing predefined anchors on the three feature pyramid layers and realizes recognition and positioning using regression. However, the number of anchors distributed in each grid cell of different scale feature layers is usually the same. The ERF (effective receptive field) corresponding to the grid cell at different locations varies. The contradiction between the uniform distribution of fixed-size anchors and the ERF size range in different feature layers will reduce the effectiveness of object detection. Few people use ERF as a standard for assigning anchors to improve detection accuracy. To address this issue, firstly, we constructed a PCB assembly scene object detection dataset, which includes 21 classes of detection objects in three scenes before assembly, during assembly, and after assembly. Secondly, we performed a refined ERF analysis on each grid of the three output layers of YOLOv3, determined the ERF range of each layer, and proposed an anchor allocation rule based on the ERF. Finally, for the small and difficult-to-detect TH (through-holes), we increased the context information and designed improved-ASPP (Atrous spatial pyramid pooling) and channel attention joint module. Through a series of experiments on the object detection dataset of the PCB assembly scene, we found that under the framework of YOLOv3, anchor allocation based on ERF can increase mAP (mean average precision) from 79.32% to 89.86%. At the same time, our proposed method is superior to Faster R-CNN (region convolution neural network), SSD (single shot multibox detector), and YOLOv4 (you only look once version 4) in the balance of high detection accuracy and low computational complexity.

Highlights

  • With the increasing influence of electronic products in social changes, major countries regard electronic product manufacturing as a strategic development industry

  • The through-hole technology (THT) in PCB assembly requires highly skilled operators trained in the corresponding standards to complete it. ese manual placement costs are high and become the bottlenecks of the intelligent manufacturing of electronic products. e most challenging problem in the THT process of PCB assembly is the messy placement of electronic components and the extremely small vias

  • We have proposed the improved-ASPP and attention mechanism joint module for YOLOv3. e biggest function of the improved-ASPP is to combine more contextual information and enlarge the receptive field. erefore, for the joint module improved YOLOv3, we use the same anchor allocation method based on ERF. ere are 5 anchors allocated to the 52 × 52 output layer, which are, respectively, [9, 14, 17, 21, 22, 22, 32, 35], and [27, 41]. e 26 × 26 output layer assigns a total of 3 anchors, which are, respectively, [30, 47], [34, 47], and [186, 120]. e 13 × 13 output layer assigns only 1 anchor, i.e., [233, 151]

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Summary

Introduction

With the increasing influence of electronic products in social changes, major countries regard electronic product manufacturing as a strategic development industry. Completing the intelligent production transformation and upgrading the electronic product manufacturing industry is an inevitable choice for the manufacturing industries of all countries. The realization of visual object detection in the entire manufacturing field of electronic products can help manufacturers eliminate labor shortages and improve product competitiveness. Visual object detection has been widely used in different stages of electronic product manufacturing, such as the manufacture of electronic components, PCB surface mounting, and reliability testing. The THT (through-hole technology) in PCB assembly requires highly skilled operators trained in the corresponding standards to complete it. Ese manual placement costs are high and become the bottlenecks of the intelligent manufacturing of electronic products. E most challenging problem in the THT process of PCB assembly is the messy placement of electronic components and the extremely small vias. Even a well-trained operator uses vision to recognize these

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