Research on Motion Simulation of Wafer Handling Robot Based on SCARA

Abstract

In the process of semiconductor manufacturing, the wafer handling robot has become an key device. The stability and repeatability of the transfer process directly or indirectly affect the manufacturing quality. This thesis focuses on the structure of SCARA (Selective Compliance Assembly Robot Arm) to study the wafer handling robot. In order to analyze the motion characteristics of the robot, the link coordinate system of the wafer transfer robot was established according to the D-H theory. And then its forward and inverse kinematics equations were deduced and calculated. According to the obtained kinematics model, the working area of the wafer handling robot could be solving by using the Monte-Carlo method. The MATLAB software was used to analyze the simulation of the robot motion, intuitively showing the motion of the robot joint and obtaining a continuous and smooth angle trajectory curve of the robot joint. Nextly, the dynamic modeling of the wafer handling robot was performed by using the Lagrangian method. The dynamics mainly studies the relationship between the force and the movement. When planning the movement of the robot, it can fully consider the limitations of the robot’s power system and plan to the required trajectory without damaging the motor. And then do the force analysis of the robot. The work done by this thesis has certain guiding significance for the designing process of wafer handling robot.