Abstract
The trend towards portability of electronic products expands the application of rigid-flex board, which has become one of the hot spots in PCB industry. Along with the improvement of assembly technology, the improving design of rigid-flex board appears. High Density Interconnection (HDI) is one of the design directions. The key manufacturing parameters of buried /blind via process in manufacturing process of HDI rigid-flex board was studied in detail including material selections, laminate process, drilling process and via metallization. Better manufacturing parameters of buried /blind via were obtained through orthogonal design. It was found over 99.9% vias could pass the test on electrical performance.
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