Abstract
Modular Multilevel Converter (MMC) is widely used in flexible HVDC transmission systems, IGBT module as its core power device, its failure process seriously affects the operation reliability of MMC. The high junction temperature is an important reason for the failure of the IGBT module, so monitoring the junction temperature of IGBT module is an important means to ensure the stable operation of the system. According to the topological structure of IGBT module, the current junction temperature monitoring methods of IGBT module are summarized and compared. According to the shortcomings of the current research and the current research status, the research direction of IGBT module junction temperature monitoring is prospected.
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