Abstract
By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are used to simulate and analyze LED packages with different materials and structures. Using the theory of LED illuminance and uniformity, the illuminance of some structures is computed. The results show that the change of substrate material and structure can greatly impact heat dissipation, while changing array forms has little effect on heat dissipation. By improving the spatial distribution of the chip, the temperature superposition problem of the substrate is solved, and the illuminance and uniformity are improved while dissipating heat. The LED filaments of the combined, equidistant, chip-distribution mode have improved heat dissipation. The S-type equal difference has the highest illumination and high illumination uniformity.
Highlights
A light-emitting diode (LED) is a solid-state semiconductor device that can directly convert electrical energy into visible light [1]
LED filament lamps require simple and stylish designs, prohibiting the implementation of bulky heat sinks such as those used in traditional patches or light sources of chip on board (COB)
The substrate material, size of heat dissipation holes, spatial distribution of the chips, and the array mode are studied in order to determine the influence of different methods for heat dissipation of the LED filament package
Summary
A light-emitting diode (LED) is a solid-state semiconductor device that can directly convert electrical energy into visible light [1]. LEDs are fourth-generation illumination sources, which have many improvements—such as higher luminous efficiency, faster startup, longer life, higher reliability, better energy savings, and increased environmental friendliness [2]—that help them meet the needs of various applications, such as displays [3,4], decoration, backlight, and lighting [5,6]. Multi-chip packaged LED arrays were designed to make the light output consistent with or even exceed that of traditional light sources [7]. LED filament lamps require simple and stylish designs, prohibiting the implementation of bulky heat sinks such as those used in traditional patches or light sources of chip on board (COB). This study aims to lay the foundation for obtaining the best heat-dissipation performance and to guide future
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
