Abstract

A novel numerical method for dynamic fracture in microscale laser peen forming (μLPF) of aluminum foils was presented and the role of the die diameter on fracture behavior at the ultra high strain rate was investigated via both experimental and numerical methods. μLPF is a process in which the plastic deformation is generated through laser‐induced shock wave and compressive residual stresses can be imparted to improve the fatigue life of micro parts. During μLPF, the pressure exerted on the target is higher than 1 GPa and the strain rate is greater than 106s−1, so the mechanical behavior of materials in this dynamic process is very different from that under static or quasi‐static conditions. In the present study, the finite element method with grain and grain boundary elements was used to analyze the μLPF process of aluminum foils with a thickness of 60 μm. The onset and propagation of crack were simulated in this way that the specified nodes were tied together until the equivalent plastic strain exceeded a certain value. Under a given value of plastic strain, the influence of die diameters of 0.6, 1.0, and 1.6 mm on the fracture mode of the material was predicted. A series of experiments were carried out to verify the numerical model. The geometrical morphologies of fracture regions were observed via optical microscope and scan electron microscope. In results from both experiments and simulations, the size of the die diameter affects the location of the fracture: (I) Fracture appeared at the entrance of the die for die diameters of 0.6 and 1.0 mm. (II) Fracture occurred near the centre of the formed dome for 1.6 mm die diameter. The generation mechanism of two fracture modes was explained. This work provides a preliminary insight into the fracture behavior of materials under the ultra high strain rate and lays the ground work for more in‐depth simulations in the future study.

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