Abstract
Temperature fast change during a step or several steps is required by latest etching process in IC manufacturing. Two methods to reach this requirement was described, and several simulation devices are designed to test the capability. The temperature control unit (TCU) need to provide two different channels coolant with high and low temperature. One method is to switch the different channels connect to main tool electrostatic chuck (ESC). Two different base temperatures can be used for main tool, the heater in the ESC is controlled to get the final temperature. Another is to mix the two different temperatures with motor valves to reach the target temperature. Two types of equipment are developed using the corresponding method. The test devices are introduced, and the test shows transient temperature response of two equipment. Both channels must return to their respective set points with ±1°C variation within 120 seconds. The maximum deviation of supply temperature must below 20 °C when temperature ramp up or ramp down. These TCU can support the latest etching process and the switch or mix test with simulation devices can be used to judge the TCU performance.
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