Abstract
Abstract Aiming at the problem of poor processing performance and difficult processing in the process of aluminum-based diamond composites for electronic packaging, this paper uses electrolytic in-process dressing (ELID) grinding technology to grind the aluminum-based diamond composites. The quadratic orthogonal rotation combination method was used to investigate the influence law and degree of grinding depth, grinding wheel linear velocity, duty cycle and electrolysis current on surface roughness. The ELID grinding optimization process parameters of aluminum-based diamond composites obtained by LINGO software are: grinding depth 9.3μm, grinding wheel linear speed 36m/s, duty cycle 63.7%, electrolysis current 11.5A. The surface of the aluminum-based diamond composite with a surface roughness of 125 nm was machined by this optimized process parameter combination.
Highlights
With the rapid development of electronic technology, the integration degree of electronic devices increases
The electrolytic in-process dressing (ELID) grinding optimization process parameters of aluminum-based diamond composites obtained by LINGO software are: grinding depth 9.3μm, grinding wheel linear speed 36m/s, duty cycle 63.7%, electrolysis current 11.5A
Due to the oxidized film forming characteristics in the ELID grinding process, the oxide film is continuously generated, and the abrasive grains are subjected to high-speed grinding and polishing of the aluminum-based diamond composite material at a large grinding wheel linear velocity.the surface grinding quality of the workpiece becomes better and the surface roughness value decreases
Summary
With the rapid development of electronic technology, the integration degree of electronic devices increases. Aluminumbased diamond composite is a diamond particle reinforced metal Al-based composite material, which has the advantages of high wear resistance, high specific strength, high specific height, high thermal conductivity and low thermal expansion coefficient It has become the hottest fourth-generation electronic packaging material, and has broad application prospects in the electronic packaging of aerospace and electronic devices. Most of the research on aluminum-based diamond composite materials is the preparation aspect, using near-net molding technology, laser selection melting technology to reduce secondary processing steps, and direct manufacturing molding technology to solve the shortcomings of difficult processing These technologies are still immature, and the surface quality of the workpieces obtained by applying these techniques in some aerospace and electronic equipment cannot meet the requirements for use [2,3,4,5].
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