Abstract
In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.
Highlights
In many forms of advanced packaging, solder bump technology has become a reliable electrical interconnection method
Solder joint defect detection and reliability assessment has become one of the key issues to be solved in IC manufacturing technology [2]
Non-contact methods consist of automated optical inspection [4], X-ray detection [5] and scanning acoustic microscope (SAM) detection method [6]
Summary
In many forms of advanced packaging, solder bump technology has become a reliable electrical interconnection method. A novel approach based on eddy current pulsed thermography was investigated for defect inspection of solder balls Both simulation and experiment on the defects of solder joint are carried out. Through numerical and experimental studies, it can be found that ECPT has both high spatial resolution and sensitivity when assessing both electrical and thermal properties [8,9,10,11,12,13,14,15] This technique has been applied to conductive composite defect inspection and classification [16,17], crack detection of rolling contact fatigue of rail tracks [18], glass fibre reinforced polymer specimen detection [19] and power electronic devices [20].
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