Abstract
Through to the research of technological parameter of copper plating on the surface CF, determining the best parameters: electroplating current is 200 mA, electroplating time is 1 h. Using vacuum hot-pressing sintering to make different composition sample, the sample organization been done the SEM microscopic analysis, and measured micro-hardness and density. Then doing comparative analysis. In the matrix, CF was found to be homogeneously dispersed into the metal matrix, increasing the density of the sample.
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