Abstract
Studying Al particles reinforced composite lead-free solder by experiments of constant temperature thermal stress aging treatment. Scanning electron microscope was used to observe the micro-structure of composite solder. The results show that composite lead-free solder after constant 125°C aging treatment for 24 hours, Al particles has two types of morphologies: one is small amount of solid solution,another type is a large number of aluminum particles structure.The existence of Al particles slowed down the coarsening rate of the Bi Phase grain, and obtained uniform refined the Bi Phase grain.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
