Abstract
The effects of aging processes on the properties and microstructure of Cu–0.3Cr–0.15Zr–0.05Mg lead frame alloy were investigated. Aging precipitation phase was dealt with by transmission electronic microscope (TEM). After solid solution was treated at 920 °C and aged at 470 °C for 4 h, the fine precipitation of an ordered compound CrCu 2(Zr, Mg) is found in copper matrix as well as fine Cr and Cu 4Zr. Along the grain boundary, there are larger chromium. The hardness and electrical conductivity can reach 109 HV and 80% IACS, respectively. Sixty percent cold-rolled deformation prior to aging at 470 °C enhances the hardness of the alloy. The coherent precipitates Cr in copper matrix and the dislocations pinned by the fine precipitates are responsible for maximum strengthening of the alloy. So the hardness 165 HV and electrical conductivity 79.2% IACS are available.
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