Abstract
With the rapid increase of power densities of electronic components, the traditional heat dissipation method of air forced convection has reached a heat transfer limit. As efficient phase change heat exchangers, vapor chambers have become an important guarantee for the development of high-power electronic components. Aluminum vapor chambers have become the future development trend because they are more lightweight and less expensive. In order to study the suitable simplified model of the aluminum vapor chamber in the radiating system, the testing system is established to test the thermal characteristics of the vapor chamber. First, six simplified models of the vapor chamber are proposed. Then, the thermal characteristics of the simplified models are simulated by STAR CCM+ software. Next, the error of the thermal resistance of the simplified model and the real vapor chamber is analyzed. Finally, a most suitable simplified model is obtained in the cooling system.
Highlights
At present, electronic devices tend to be miniaturized and compact [1,2]
The heat transfer process of vapor chamber is divided into four stages: (1) the working fluid absorbs heat in the evaporation surface to generate steam; (2) the steam flows to the condensation surface under the pressure difference; (3) the steam is liquefied at the condensation surface; and (4) the liquid returns to the evaporation surface under capillary force and continues to vaporize
The results showed that the anisotropic method can better represent the heat transfer characteristics of the vapor chamber
Summary
Electronic devices tend to be miniaturized and compact [1,2]. the power density of electronic devices is increasing [3]. Koito et al [9] divided have studied the phase change heat transfer in heat pipes, and analyzed the internal temperature the vapor chamber model into vapor region, liquid-wick region, and wall region. [18] proposed a model to simulate the dynamic behavior and of the the same the capillary pressure required for the working fluidsteady-state to circulateperformance inside the vapor flat heat pipe on some assumptions. The wall, the coupled heat and mass transfer at the liquid–vapor interface and the fluid flow in the developed a three-dimensional model to analyze the thermohydrodynamic behavior in the flat heat vapor chamber and porous wereinconsidered. In the numerical simulation research, the flat heat pipe was simplified into a solid block with inherent effective thermal conductivity. Six simplified models of the vapor chamber are established, which are numerically simulated to obtain their thermal performance. The error between the simplified model and the real vapor chamber is analyzed to get the suitable simplified model, which provides significant guidance for the numerical simulation of the heat dissipation system of the vapor chamber
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