Abstract
The sensing principle of FBG packaged was developed, and packaging technology for fiber Bragg gratings (FBGs) and the embedding technique were studied. A scheme of packaging technology using the red copper slice for FBGs was presented, and experimental results indicate that the strain sensitivity coefficient of FBG packaged is nearly the same as that of the bare FBG, and that the FBG packaged can measure the 1μe change, and that the temperature sensitivity coefficient of FBG packaged is 2.97 times as much as that of the bare FBG, and that the packaging structure using red copper slice improves the temperature resolution of demodulation equipment for FBG sensors, and that the FBG packaged sensors can measure the 0.03°C change.
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