Abstract
The aim of work consists in the study of interactions on solder/substrate boundary in fluxless soldering of Al with 4N purity by ultrasound activation. The ZnAg6Al6 and ZnAl4 solders were used in experiments. The soldering parameters were as follows: soldering temperature from 400 oC to 420 oC, acting time of ultrasonic vibrations 5 to 20 s, ultrasound frequency 40 kHz. Soldered joints were assessed by optical light microscopy, EDXmicroanalysis and XRD analysis. It was found out that the ZnAg6Al6 solder is composed of αAl, βZn solid solutions and AgZn3phase. The ZnAl4solder consists of βZn primary solid solution and a lamellar eutectic Zn-Al structure. The main mechanism of joint formation between the solders type Zn-Al and Al substrate during soldering consists in eutectic reaction between the liquid Zn and solid Al. An eutectic βZn-αAl mixture was observed on the joint boundary in case of both solders. In case of Al/ZnAg6Al6 joint also AgZn3intermetallic compound was observed in the transition zone.
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