Abstract
The features of the formation of microconnections in electronic modules on an aluminum-polyimide basis by the method of ultrasonic welding, which allows to obtain reliable mounting joints of different thickness aluminum without preliminary removal of oxide films where the use of contact welding and soldering are practically difficult or impossible, are investigated. The influence of technological modes (power of an ultrasonic generator, oscillation amplitude of a welding tip (tool), welding force and welding time) on the reliability of mounting microconnections is considered
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