Abstract

Waterborne polyurethanes (WPUs) have been pushing toward more multifunctional directions developing which is due to the more extensively utilized in the world. Obviously, electronic devices are becoming more miniaturization and intelligentialize, accompanying many problems (e.g., heat dissipating and heat aging) to resolve. Organic polymers are to be good substitute for metal substrate used in devices because of their excellent performances. However, due to the most of polymers are poor conductor of heat, so many researchers utilize the hybrid method to enhance thermal conductivity of composites, through the pathway formed by fillers connection to build heat networks for phonon conduction. In this study, we do some reviews of WPU/composites on heat conducting. We put a focus on the enhancement of thermal conductivity through the compatibility and feasibility of hybrid methods, which includes the physical and chemical modification with non-covalent and covalent bond interactions. Plus, referring to laboratory previous study of heat conduction, on which pure WPU possessed with short-range, long-range ordering and microcrystal structures can facilitate the phonon conduction with the improvement of thermal conductivity.

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