Abstract
Surface micro-/nanostructures are widely used in the fabrication of various functional microsystems. Laser-induced plasma micromachining can greatly improve surface quality in terms of recast layers and thermal defects compared with laser direct writing. Magnetic field has the ability to constrain plasma diffusion and can ensure the stability of laser-induced plasma processing. This paper compares the effects of laser direct–writing processing and laser-induced plasma processing of single-crystal silicon at the micro-/nanoscale, and emphatically analyzes the material removal mechanism of repulsive magnetic field–assisted laser-induced plasma micromachining. It is shown that the volume of the laser-induced plasma was constrained under the influence of Lorentz force, a high-quality smooth microgroove without thermal defects was obtained, and its line width was reduced by 30%.
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