Reprocessable low-dielectric styrene resins with coordination bonds: the effect of metal centers on low dielectric, mechanical, and reprocessing properties

Abstract

Dynamic bond chemistry provides a new opportunity for the reprocess and reuse of low-dielectric resins. In this study, based on our previous study, a series of reprocessable low-dielectric styrene resins were prepared by incorporating coordinated crosslinked structures with Cu, Zn, and Ni centers. The low-dielectric properties, mechanical strength, and reprocessing performance of styrene resins were significantly affected by the metal centers. Styrene resins with Cu and Ni centers (PSVP-Cu and PSVP-Ni, respectively) possessed high mechanical strength and low dielectric constant than that styrene resin with Zn center (PSVP-Zn). Further investigation indicated that PSVP-Cu and PSVP-Ni had relatively high cross-linking densities, possibly owing to the relatively high bonding energies of Cu-pyridine and Ni-pyridine. After the 3rd cycle, PSVP-Ni preserved its high mechanical strength and low dielectric constant, thereby exhibiting good recyclability for potential applications.