Replication of micro optical element with continuous relief profile in fused silica using UV-embossing and Reactive Ion Etching

Abstract

In order to replicate micro optical element with continuous relief profile into fused silica, UV-embossing and Reactive Ion Etching process were used. Micro optical element with continuous relief profile was formed in UV-curing resist coated on fused silica during UV-embossing, and then transferred into fused silica through Reactive Ion Etching process with CHF 3 and oxygen mixture gas. An acrylate-based polymer resist without silicon was applied to emboss the micro optical element. The selectivity of resist and substrate was tested through Reactive Ion Etching experiment under different gas components. The profile test results of micro optical element after etching showed that the continuous relief profile of micro optical element was precisely transferred into fused silica, and profile roughness after etching was less than 30 nm. It can therefore be concluded that the proposed process can be used for replication of micro optical element with continuous relief profile in fused silica.