REP EcoDesign Tomorrow

Abstract

REP (Japan Institute of Electronic Packaging) is the largest organization in Japan to investigate and exchange knowledge on Electronic Interconnection and Packaging Issues. The organization first co-organized Environmentally Conscious Engineering in Electronics '96 cooperating with LCA forum of Japan and University of Tokyo / Inverse Manufacturing Laboratory in 1996 and has since been playing major roll in Environmentally Conscious Engineering Issue in Electronic Packaging Industry. The emerging growth of IT(Information. Technology) Industry is expecting huge demand on resource and waste disposal. Elimination of toxic substances, such as VOC, lead in solder, halide in substrate, from waste is still very important subject for JIEP Environmentally Conscious Engineering. However, it should not be the only subject. As no Electronic Equipment is realized without Electronic Packaging Technology (Jisso or technology is more commonly used in the industry as it has more integral meaning) the issue of Energy saving, Material saving are also the subjects of Jisso design. Recycling is also a very important subject of material saving and the subject of ecology as well. All these subjects are those of REP EcoDesign Tomorrow. Performance, cost and environmentally conscious thinking are three factors to form axis of Engineering thinking.