Removal of micro-nano particles based on water-assisted enhanced plasma shock wave

Abstract

Foreign micro/nanoparticles can compromise the production and performance of semiconductors, high-energy laser systems, and other technologies. Owing to the strong adhesion (in GPa) of these particles to the surfaces of these devices, removing them using traditional methods such as ultrasound is difficult. Laser plasmas at high temperatures and pressures can effectively clean the micro/nanoparticles. Compared with traditional air media, laser plasma generates stronger shock waves and water flow erosion underwater, which can effectively clean these particles. In this study, we analysed the particle removal process under the action of laser plasma in water dielectrics, primarily the distribution characteristics of particles under spatial phase transition, final removal efficiency, removal thresholds, and optimal removal regions of particles with different sizes, as well as the corresponding academic analysis based on thermodynamic effects. We used a silicon wafer that was subjected to a high-energy laser beam to generate plasma shock waves underwater, which were used to remove micro- and nano-sized impurities. We found that the shock wave pressure of the plasma and water flow gradually decreased from the centre to the outside, and the corresponding action region could be divided into three areas, namely, 0–30°, 30–45°, and 45–50°, with particle removal rates of 96.93 %, 75.52 %, and 36.60 %, respectively. For particles in the 0–30° and 30–45° regions, the maximum removal rate corresponded to particle sizes ranging from 50–200 nm and greater than 200 nm, respectively. However, in the 45–60° region, the pressure of the shock wave was lower than the fragmentation threshold and, hence, had the worst particle removal effect owing to the lowest pressure. We believe that these findings will provide guidance for the subsequent development of particle removal technologies using underwater laser plasma shock waves.